PCB Fabrication

Common types of PCB production we offer include:
High Mix Low Volume (HMLV) Production for Low and High technology PCB’s, Medium Volume Production 1-40 layer, High Volume Production 1-40 layer, Flex and Rigid Flex.

Learn More

HDI Technology

Reasons to implement HDI:
Surface real estate
Signal isolation
Reduced signal antenna (less noise)
Different component footprints top to bottom

Learn More

Flex Capabilities

PalPilot offers flex capabilities when making boards. From flex and rigid flex, to adhesiveless rigid-flex, each board construction has its own unique advantages.


Learn More

PCB 101

Get an overview of our manufacturing process from start to finish. Learn how we deliver your needs starting from the pre-clean and imaging resist coat all the way to the lamination and drilling.


Learn More

PCB Top 10 DFM Guidelines

From material selection, impedance, via structures, trace and space, drills and padstacks, surface finish, via treatments, mechanical features, internal and external thieving. Our guidelines teach you things to watch out for.

Learn More

PCB Tolerances

The tolerances for all our products. From the overall board thickness, individual laminate thickness, board outline dimensions, soldermask and plating, hole sizes, routed features, annular ring, true position and impedance.

Learn More

Advanced Laminates

Find out the advantages of what advanced laminates can do for you. From metallization on Si-Hy-Pl, RTR manufacturing, the different properties and pre-drilled metallization.

Learn More