Metallization on Si-Hy-PI
- The interlayer roughness of a product prepared by the direct electroless plating method is very small. advantage to high frequency transmission
- The copper thickness is adjustable. advantage to fine-pitch formation shortening of etching time applicable to semi-additive process
- Laser drill on PI energy saving 90% compare with drilling on Cu foil FCCL.
- PI Laser punch type drill speed is around 4 times higher than Laser circle type drilling on Cu FCCL.
- Through hole or fully filled hole is easily selectable.
RTR UV Laser Processing System
Features & Advantages
- Super Thin Copper Thickness => Thinner Copper gives better etching factor, fold ability, and fine pitch capability.
- Ultra Low Roughness Profile of Copper => Nano scale Copper Profile provides better Circuit Conductivity and lower Impedance, good for high frequency circuit design.
- Excellent Peel Strength Stability => Nano size anchors between PI and Copper contribute good peel strength after Heat Aging.
- Excellent Dimension Stability => CTE of Pomiran PI film is design to match Copper, more than that, wet process direct metallization on PI film provides very low thermo stress.
- Unique Pre-drilled Capability => Not only shorten the FPC manufacturing processes and save cost, but also reduce the waste of the earth's resources.