PalPilot’s Interconnect Division is turning heads, by offering Thermal Engineering Solutions for High Speed I/O Connector and Cages.
With 5G and IoT era approaching, the demand for faster data rate is growing. This aggressive need for speed creates big challenges in heat dissipation. PalPilot proudly offers Thermal Engineering Services for High Speed I/O products. We have domestic experienced engineers, and a strong manufacturing team in Asia to provide:
- Concept Design
- DFM Review, Thermal Simulation, Thermal Analysis
- Prototype Building and Mass Production Planning
- Competitive Pricing
We know thermal, and we know our cages. Let us design the perfect solution that meets your requirements. With our expertise and teamwork, the lead time for turning concept to first article sample will be faster than you think.
To learn more about PalPilot’s Interconnect Capabilities, visit us at: www.palpilot.com/high-speed-io-series/
World Class Engineering and Manufacturing: All PalPilot Interconnect Division Services are designed to meet SFF standards and are RoHS compliant.
Our team recognizes the importance of supply and demand; each task is carefully executed. The significance of our component supply chain demonstrates our ability to adapt to the ever-changing dynamics of the electronics industry.
About PalPilot Interconnect Division: PalPilot International Corporation, a global company with manufacturing in Asia and business offices in the US and EU. With 20+ years of experience, PalPilot has proved itself to be a valuable asset in the core industries of PCB Engineering, Manufacturing, Mechanical Services, and Components. “Pal” embodies the value of a strong customer and partner relationship and recognition; “Pilot” demonstrates our forward drive as a supply and demand solution leader.