Common types of PCB production we offer include:
High Mix Low Volume (HMLV) Production for Low and High technology PCB’s, Medium Volume Production 1-40 layer, High Volume Production 1-40 layer, Flex and Rigid Flex.
Reasons to implement HDI:
Surface real estate
Reduced signal antenna (less noise)
Different component footprints top to bottom
PalPilot offers flex capabilities when making boards. From flex and rigid flex, to adhesiveless rigid-flex, each board construction has its own unique advantages.
Get an overview of our manufacturing process from start to finish. Learn how we deliver your needs starting from the pre-clean and imaging resist coat all the way to the lamination and drilling.
PCB Top 10 DFM Guidelines
From material selection, impedance, via structures, trace and space, drills and padstacks, surface finish, via treatments, mechanical features, internal and external thieving. Our guidelines teach you things to watch out for.Learn More
The tolerances for all our products. From the overall board thickness, individual laminate thickness, board outline dimensions, soldermask and plating, hole sizes, routed features, annular ring, true position and impedance.Learn More
Find out the advantages of what advanced laminates can do for you. From metallization on Si-Hy-Pl, RTR manufacturing, the different properties and pre-drilled metallization.Learn More