Virtual/Augmented Reality Miniaturization Trends

Component
Type
BGA CSP WLP Bare Die
Pitch 1.0 0.8 – 0.4 0.4 – 0.2 Flip Chip
Wire Bond
Routing 5.0 mil
(125 um)
3.0 mil
(75 um)
1.0 mil
(25 um)
1.0 mil
(25 um)
Fabrication
Solutions
PCB
HDI
Rigid/Flex
Next Gen PCB Substrate