Packaging Systems
Advanced Packaging Solutions
Custom BEOL package solutions spanning design through assembly and test, supporting PoP and SiP modules across IoT, mobile, optical, high-speed, memory, and industrial applications.
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What We Offer
Turn-Key Package Design
Wafer-Processing
Substrate Fabrication
Package Assembly
2.5D/ 3.0D Chiplet
Capabilities
PalPilot enables customer specific Back End of Line (BEOL) Packaging System solutions & services.
- Design Service: Substrate & Packaging
- SI/PI Modeling
- Wafer Process: Cu Pillar Plating, Grinding Dicing
- Substrate Fabrication: FCBGA (Small & High Volume)
- Package Assembly: 40um Flip Chip Pitch
- Advanced Packing System: TSV + Multi Layer RDL
Substrate Solutions
PalPilot’s substrate division delivers full interconnect solutions from SI/PI modeling, interconnect routing & fabrication.
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Full Package Modeling & Design Service
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5 & 7 Day BGA/CSP Quick Turn Fabrication
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Ultra-Thin “Coreless” Package Structures
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Ceramic On Organic Laminate (COOL) Package Product Launch
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Full Package SiP Product Solutions
Package System Design
Custom Package System design including substrate selection/routing, package assembly structure definition (PoP, SiP, single die, etc.) meeting industry specific DFM & reliability requirements (Deliverables: 2D DXF & Various Design Files).
Signal/Power Integrity Modeling
PCB & Package system, passive interconnect, electrical signal & power modeling (Deliverables: SI/PI Report & Program Files).
Industry Focused Package Systems Integration
B2B Package Systems, technology & supply program management/development from NPI, production ramp, to high volume manufacturing of high power, high speed package systems showing calculated improvement of customer’s corporate ROA components
(Deliverable: A calculated improvement of customers ROA components including impact on Revenue, SG&A, COGS, Fix/Current Asset).
Thinking globally. Acting locally.
PalPilot enables application-specific semiconductor packaging solutions backed by global manufacturing capabilities and strict quality standards. Our team supports customers from design through production to deliver reliable, scalable technologies.
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FAQs
PalPilot delivers customer-specific BEOL (Back End of Line) packaging system solutions, covering design, wafer processing, substrate fabrication, package assembly, and test
Yes. PalPilot provides turn-key package design, including substrate and package design, SI/PI modeling, and full system definition to ensure performance and manufacturability
We support advanced packaging systems, including 2.5D / 3.0D chiplet packaging, TSV integration, and multi-layer RDL architectures for high-performance applications
Our capabilities include wafer processing, Cu pillar plating, grinding and dicing, and Au or Cu bumping for flip-chip applications
PalPilot supports FCBGA substrate fabrication for both small and high-volume production, with fine features such as 15µm line/space, TSV ~1.0µm, and multi-layer RDL.
We support package assembly with fine-pitch flip-chip, including 40µm flip-chip pitch, plated circuitry, molding compounds, and optional solder mask processes.
Our packaging systems support wearable/IoT, mobile, optical/VCSEL, high-speed/wide-bandwidth, memory, and advanced thermal applications, serving automotive, medical, communications, consumer, and industrial markets.
Build What’s Next
From first prototypes to high-volume production, our engineers are ready to guide your project forward.
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