Packaging Services

PalPilot provides custom BEOL Package System solutions & services including design, SI/PI modeling, wafer bumping, substrate fabrication, package assembly/test and PoP/SiP module definition and manufacturing.  Applications include, wearable/IoT, Mobile/Hand Held, Optical/VCSEL, High Speed/Wide Bandwidth, memory and advance thermal packaging solutions.  Typical industries serviced include, Automotive, Medical, Communications, Consumer, General Industrial.

Package System Design 

Signal/Power Integrity Modeling

Package System 3D Mechanical Modeling

Packaging Assembly & Test

Industry Focused Package Systems Integration

Package System Design 

Custom Package System design including substrate selection/routing, package assembly structure definition (PoP, SiP, single die, etc.) meeting industry specific DFM & reliability requirements (Deliverables: 2D DXF & Various Design Files).

Signal/Power Integrity Modeling

PCB & Package system, passive interconnect, electrical signal & power modeling (Deliverables: SI/PI Report & Program Files).

PalPilot’s substrate division delivers full interconnect solutions from SI/PI modeling, interconnect routing & fabrication. 

 

  • Full Package Modeling & Design Service

  • 5 & 7 Day BGA/CSP Quick Turn Fabrication

  • Ultra-Thin “Coreless” Package Structures

  • Ceramic On Organic Laminate (COOL) Package Product Launch

  • Full Package SiP Product Solutions

Package System 3D Mechanical Modeling

Package System 3D mechanical design (Deliverables: 3D STEP Files).

Packaging Assembly & Test
(Product Fabrication/Manufacturing)

Substrate fabrication integrated with package assembly/test (Deliverable: Fully tested packaged components).

Going beyond PCB, PalPilot offers packaging services to give the full spectrum from 0 to unlimited.

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Industry Focused Package Systems Integration

B2B Package Systems, technology & supply program management/development from NPI, production ramp, to high volume manufacturing of high power, high speed package systems showing calculated improvement of customer’s corporate ROA components (Deliverable: A calculated improvement of customers ROA components including impact on Revenue, SG&A, COGS, Fix/Current Asset).

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