Packaging Services

PalPilot provides custom BEOL Package System solutions & services including design, SI/PI modeling, wafer bumping, substrate fabrication, package assembly/test and PoP/SiP module definition and manufacturing.  Applications include, wearable/IoT, Mobile/Hand Held, Optical/VCSEL, High Speed/Wide Bandwidth, memory and advance thermal packaging solutions.  Typical industries serviced include, Automotive, Medical, Communications, Consumer, General Industrial.

Going beyond PCB, PalPilot offers packaging services to give the full spectrum from 0 to unlimited.

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“Pal” embodies the value of strong customer and partner relationship and recognition; “Pilot” demonstrates our forward drive as a supply and demand solution leader.

Northern California Office 

(408) 855-8866

contact@palpilot.com

500 Yosemite Drive, Milpitas, CA 95035

Southern California Office 

(714) 460-0718

contact@palpilot.com

15991 Red Hill Ave. Suite 102 Tustin CA 92780

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