PalPilot’s Printed Circuit Division provides our customer with a one stop solution from prototype, High Mix Low Volume (HMLV), to High Volume PCB’s, and capabilities that encompass Every Layer Interconnect (ELIC), High Density Interconnect (HDI), Via In Pad Plated Over (VIPPO), Back Drilling, Flexible Printed Circuits (FPCB), Rigid-Flex Circuits (RFPCB) and more.
Meet Projects of All Sizes
Complete PCB Supply Chain
PalPilot’s PCB manufacturing division offers solutions to meet your needs no matter the mix or volume. Our experienced Engineer Team will help every step of the way from design to development; and our offshore factories afford us production capacity to meet projects of all sizes.
Common types of PCB production we offer include:
High Mix Low Volume (HMLV) Production for Low and High technology PCB
Medium Volume Production 1-40 layer
High Volume Production 1-40 Layer
Flex and Rigid Flex, Prototype, small, medium, and high-volume production.
Business moves fast, that’s why we pride ourselves in offering quick turnaround (5-10 days from Asia), so you can meet aggressive deadlines. We also offer 24 hours PCB design services to make sure we are here when you need.
PalPilot’s value solutions consists of the following:
Experienced sales team, complete PCB supply chain, design, development and production capacities, broad spectrum of technologies and capabilities, multiple manufacturing locations with single contact window, engineering, customer service, and quality interface in USA, Taiwan, and China.
Our team recognizes the importance of supply and demand; each task is carefully executed.
The significance of our component supply chain demonstrates our ability to adapt to the ever-changing dynamics of the electronics industry.