PCB Fabrication
PalPilot’s Printed Circuit Division provides our customer with a one stop solution from prototype, High Mix Low Volume (HMLV), to High Volume PCB’s, and capabilities that encompass Every Layer Interconnect (ELIC), High Density Interconnect (HDI), Via In Pad Plated Over (VIPPO), Back Drilling, Flexible Printed Circuits (FPCB), Rigid-Flex Circuits (RFPCB) and other PCB specialty offerings.
From Porto Type to Production
Quick Turnaround
Experienced Team
Complete PCB Supply Chain
CAPABILITIES
PalPilot’s PCB manufacturing division offers solutions to meet your needs no matter the mix or volume. Our experienced Engineering Team will help every step of the way from design to development; and our offshore factories afford us production capacity to meet projects of all sizes.
Common types of PCB production we offer include:
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High Mix Low Volume (HMLV) Production for Low and High technology PCB
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Medium Volume Production 1-40 layer
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High Volume Production 1-40 Layer
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Flex and Rigid Flex, Prototype, small, medium, and high-volume production.
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Other PCB specialty offerings:
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Backplane
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Heavy Copper
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Metal Back
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ATE
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LED
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Business moves fast, that’s why we pride ourselves in offering quick turnaround (3-10 days) to
meet your time-to-market needs and aggressive deadlines.
PalPilot’s value solutions consist of the following:
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Experienced Customer Service Team (Inside Sales, Sales, Engineering, Quality, etc.)
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Complete PCB Supply Chain (Rigid, Flex & Rigid-Flex)
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Broad Spectrum of Technologies and Capabilities
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Multiple Manufacturing Locations with Single Contact Window
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Manufacturing located in USA, Japan, Taiwan, and China
*PalPilot is not ITAR Registered*
Our team recognizes the importance of supply and demand; each task is carefully executed.
The significance of our component supply chain demonstrates our ability to adapt to the ever-changing dynamics of the electronics industry.
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